AMP OnePT "Ultra Low Voiding" Pb-Free No-Clean Solder Paste

AMP OnePT Solder Paste is redefining the voiding standard for PCB assembly. Combining industry low levels of voiding performance with excellent activity allows AMP OnePT to deliver an unmatched ability for assemblers to amplify their process window while achieving higher yields. AMP OnePT has been formulated to generate flux residues which are pin testable. When coupled with SN100CV or LF-C2 alloys, AMP OnePT provides a high reliability solution for harsh environments. AMP OnePT combined with TempSave B37 alloy (Nihon Superior) is an excellent low temperature solder paste. This Pb-free alloy contains 37% Bismuth which eliminates the brittleness 
issues of standard Sn/Bi57/Ag1 and Sn/Bi58 alloys.

ATTRIBUTES:

• Ultra low-voiding 
• Pin testable 
• Excellent printability 
• Very low solder balling
• Halide and halogen free

 CALIFORNIA PROP 65 WARNING: This product contains chemicals known to the State of California to cause cancer and birth defects or other reproductive harm.