SN100C Solder was developed by Nihon Superior to offer a technically superior and more economical option to the tin-silver-copper alloys also being considered. SN100C solder is also a low-cost alternative to SAC305 solder.
The finely dispersed micro-structure of SN100C solder makes it possible to roll very thin foil without defects. The melting behavior of SN100C solder (Sn-0.7Cu-0.05Ni+Ge) provides excellent characteristics during reflow. Low inter-metallic growth provides high reliability and flexibility. SN100C solder creates less dross than SAC305 alloy. This is due to germanium which is the primary anti-oxidant in SN100C alloy. Germanium reduces the dross rate of SN100C which results in low operating cost than SAC305 alloy.
CALIFORNIA PROP 65 WARNING: This product contains chemicals known to the State of California to cause cancer and birth defects or other reproductive harm.