AMP Wash "Ultra Low Voiding" Pb-Free Water-Soluble Solder Paste

AMP WASH Solder Paste is part of the AMP One series of ultra-low voiding solder pastes. AMP Wash is a Pb-free water-soluble solder paste which performs excellently in SMT print and reflow applications. It has been developed to provide ultra-low voiding in solder joints, and the flux residues are easy to remove using de-ionized water. When coupled with SN100CV or LF-C2 alloys, AMP Wash provides a high reliability solution for harsh environments. AMP Wash combined with TempSave B37 alloy is an excellent low temperature solder paste. This Pb-free alloy contains 37% Bismuth which eliminates the brittleness issues of standard Sn/Bi57/Ag1 and Sn/Bi58 alloys. 

ATTRIBUTES:
- Ultra-Low Voiding
- Excellent Activity
- Excellent Printabililty
- Easily Cleaned

 CALIFORNIA PROP 65 WARNING: This product contains chemicals known to the State of California to cause cancer and birth defects or other reproductive harm.